Tell us about your board so we can generate your quote. Items marked with an orange asterisk*
are required.
This assembly quote assumes:
- Your assembly fits within our standard capabilities and Assembly Order Terms & Conditions
- Your kit is complete, your parts are identified and
you don't mix kits from different jobs in the same box
- The files you send us are complete and accurate
Note that if you send us non-functioning components or pcbs in your kit, we are not liable for repair, rework or replacement of the assembly. We strongly recommend that your boards be electrically tested at the board fab house and have complete solder mask and silk screen.
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Desired Board Quantity
The number of PCBs you would like us to assemble.
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Total # of Manufacturer Part #s (BOM line items)
This is the number of different part numbers used on your PCB assembly. In other words, if you send us a box with all of the parts, how many different bags will there be? In most cases, this is the number of line items in your Bill of Materials (BOM).
For example, a 10k resistor and a 1k resistor would be considered 2 Manufacturer part #s and a 20k resistor used at 4 different locations, R6, R7, R11 and R15, would be considered as one Manufacturer part #.
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Double Sided SMT?
Are there surface mount components on both sides of your PCB?
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Lead-Free processing?
Do you need lead-free RoHS (Reduction of Hazardous Substances) processing?
If so, we will build your assembly with fully RoHS compliant process and supplies.
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SMT
The total number of surface mount parts to be placed on the board (Example: 0805 resistor or TSOP chip). This count should not include any parts listed below in the Fine Pitch, thru-hole or BGA/QFN/Leadless boxes.
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Thru-Hole
The total number of thru-hole parts. (Example: Axial leaded resistor). Note that thru-hole connectors count as one each, regardless of the number of pins they have.
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Fine Pitch
The total number of surface mount devices that have a spacing of 20 mils or less from lead center to lead center. (Example: QFP with 15 mil lead pitch)
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BGA/QFN/Leadless
A BGA (Ball Grid Array device), QFN (Quad Flat-pack no leads) or other parts without leads. These are surface mount devices with all interconnects or solder joints under the device. Screaming Circuits does 100% post assembly X-ray inspection of all leadless solder joints.